| PART |
Description |
Maker |
| 107-1423 107-1419 107-1422 104330 104334 104335 10 |
SPRING LOADED CONTACT
|
Winchester Electronics Corporation
|
| P70-1100045R |
SMT SPRING LOADED POGO PIN IN TAPE AND REEL
|
Harwin Plc
|
| P70-1020045R P70-1000045R P70-1010045R P70-1030045 |
SMT SPRING LOADED POGO PIN IN TAPE AND REEL
|
Harwin Plc
|
| 806-22-001-30-004191 |
Spring-Loaded Pin with Removable Pick and Place Cap
|
Mill-Max Mfg. Corp.
|
| 806-22-001-30-003191 |
Spring-Loaded Pin with Removable Pick and Place Cap
|
Mill-Max Mfg. Corp.
|
| 0901301126 90130-1126 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)
|
Molex Electronics Ltd.
|
| MM-B2400-R963 0365090025 36509-0025 |
2.54mm (.100) Pitch DIN 41612 Receptacle, Right Angle, Through Hole, with 64 Contacts Loaded, 1.27μm (50μ) Gold (Au) Selective, Lead-Free
2.54mm (.100") Pitch DIN 41612 Receptacle, Right Angle, Through Hole, with 64 Contacts Loaded, 1.27渭m (50渭") Gold (Au) Selective, Lead-Free
|
Molex Electronics Ltd.
|
| SD-95501-001 |
Modular Jacks, Low Profile, Trough Hole, 8 Positions, 8 loaded, Keyed
|
Molex Electronics Ltd.
|
| 90130-1226 0901301226 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1254 0901301254 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 54 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 54 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1234 0901301234 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
|
